POWATEC wafer mounter Model P-200 allows bonding of films on wafer / substrate and frame in a single pass. The wafer is held by vacuum during the mounting process to an antistatic frits (carbon).
POWATEC wafer mounter Model P-200 allows bonding of films on wafer / substrate and frame in a single pass. The wafer is held by vacuum during the mounting process to an antistatic frits (carbon).
It is a multi-purpose automatic bond test system that can perform various tests simultaneously by installing up to 4 different load cartridges and automatically replacing cartridges within 3 seconds by clicking the program button .
The Die Bonder model PP6 is the most versatile semi-automatic Flip-Chip Platform.Designed for accurate placement of delicate devices on substrate.It achieves high accuracy placement using high quality optical device.
The WB200-e series are designed as a multi-purposes semi automatic wire bond tools for R&D purpose, prototype and small series production.
UniTemp - your partner for all kind of thermal processes We develop and sell equipment for microelectronics. Our main focus is based on thermic process engineering. UniTemp combines the technical, ergonomical and economical function with perfect harmony in technics and design to achieve best quality.
WX3000 3D and 2D metrology and inspection system provides the ultimate combination of high speed, high resolution and high accuracy for wafer-level and advanced packaging applications to improve yields and productivity. Powered by Multi-Reflection Suppression® (MRS®) Sensor Technology.
• BONDJET BJ653: WIRE BONDER FOR MANUAL OR
AUTOMATIC WIRE BONDING (WEDGE-WEDGE AND
BALL-WEDGE)
• BONDJET BJ855: HIGH SPEED FULLY AUTOMATIC FINE
WIRE BONDER (WEDGE-WEDGE AND BALL-WEDGE)
• BONDJET BJ955/959: FULLY AUTOMATIC HEAVY WIRE
WEDGE-WEDGE BONDER FOR HEAVY WIRE AND
RIBBON (AL, ALCU, CU)
• BONDJET BJ931: FULLY AUTOMATIC DUAL-HEAD
LEADFRAME WEDGE-WEDGE WIRE BONDER FOR
HEAVY WIRE AND RIBBON (AL, ALCU, CU)
• BONDJET BJ985: FULLY AUTOMATIC HEAVY WIRE
WEDGE BONDER WITH A LARGE WORKING AREA
• SMART WELDER SW1085: FULLY AUTOMATIC
ULTRASONIC WELDER WITH A LARGE WORKING AREA
AND ROTATIONAL WELDHEAD
Debut of Flip Chip Bonding system that meets the needs of your production.TDK, an electronic supplier, has completely evaluated the production to find the needs of users and produced this highreliable, space-saving, highspeed equipment for your specific needs.
INSPECTION SYSTEMS ( OPTICAL INSPECTION AND POST BOND INSPECTION SYSTEM ) MEASUREMENT SYSTEMS.
(WAFER THICKNESS MEASUREMENT SYSTEM ROBOTIC & HANDLING SYSTEMS )
ROBOTIC & HANDLING EQUIPMENT
WAFER & STRIP HANDLING WAFER PACKING SYSTEM